NXP TEF80x Automotive System Basis Chip

Integrated power management and CAN transceiver for automotive body electronics applications. Original NXP parts with technical support from authorized distributor.

Product Overview

NXP TEF80x Automotive System Basis Chip

The TEF80x series represents NXP's automotive System Basis Chips (SBC) that integrate power management and CAN transceiver functions in a single package. These devices are designed for cost-effective and space-efficient implementations in automotive body electronics applications.

These SBCs combine voltage regulation, CAN physical layer transceiver, and system monitoring functions, reducing component count and board space requirements. The TEF80x series is optimized for 12V automotive electrical systems and provides robust performance in harsh automotive environments.

Key Features:

  • Integrated 5V/3.3V voltage regulators
  • High-speed CAN transceiver
  • Watchdog timer and reset functions
  • System monitoring and protection
  • Low quiescent current for sleep mode
  • Protection features: OVP, UVLO, thermal shutdown
  • Package: HVQFN-24, SOIC-24
  • Temperature range: -40°C to +150°C

Specifications

Parameter Specification
Input Voltage Range 5.5V to 40V (with OVP)
Output Voltages 5V and 3.3V configurable outputs
Output Current Up to 150mA each output
CAN Interface High-speed CAN (ISO 11898-2)
Standby Current Typically <100 µA
EMC Performance Automotive qualified EMC performance
Package HVQFN-24, SOIC-24
Operating Temperature -40°C to +150°C

Availability & Pricing

Stock Status: In Stock - Ready to Ship

MOQ: 1000 pieces for samples, 10000 pieces for production

Lead Time: 2-4 weeks standard, 4-6 weeks for large orders

Warranty: 2 year defect coverage with automotive-grade quality

Alternative Options

Looking for different features or performance? Consider these alternatives:

  • TJA1145 - Standalone CAN transceiver with similar features
  • SBC37152 - For applications requiring LIN interface
  • VR5510 - For applications with different voltage requirements

Applications

Body Control Modules

Power window, door lock, and lighting control systems.

Seat Control

Memory seat position and heating/cooling systems.

Climate Control

HVAC systems with CAN communication.

Mirror Control

Power folding and positioning of mirrors.

Technical Documentation

Datasheet

Download Datasheet

Reference Manual

Download Manual

Evaluation Board

EVK Info

Application Notes

AN Collection

System Integration Benefits

Reduced Component Count

Integrates voltage regulators, CAN transceiver, and system functions in a single chip.

Lower PCB Area

Compact solution reduces board space requirements for cost-sensitive applications.

Enhanced Reliability

Fewer external components result in higher system reliability.

Automotive Qualified

Qualified to AEC-Q100 standards with long-term availability commitment.

FAQ

Q: What is a System Basis Chip (SBC)?

A: A System Basis Chip integrates multiple functions required in automotive applications, such as voltage regulation, CAN transceivers, and system monitoring, into a single package. This reduces component count and board space compared to discrete implementations.

Q: What voltage outputs does the TEF80x provide?

A: The TEF80x provides configurable 5V and 3.3V outputs, typically capable of sourcing up to 150mA each, suitable for powering microcontrollers and other digital circuits in automotive applications.

Q: What protection features are included?

A: The TEF80x includes over-voltage protection (OVP), under-voltage lockout (UVLO), thermal shutdown, and short-circuit protection to ensure robust operation in harsh automotive environments.

Q: Can the TEF80x operate in automotive sleep modes?

A: Yes, the TEF80x is designed with very low standby current (typically <100 µA) to support automotive sleep modes and reduce power consumption when the vehicle is off.

Design Considerations

When implementing the TEF80x in your design, consider:

  • Input Filtering: Proper input capacitor selection for EMI performance
  • Thermal Management: Adequate copper area for heat dissipation
  • EMC Compliance: Layout guidelines for automotive EMC requirements
  • Backup Operation: Behavior during low battery conditions

Our FAEs can provide specific design guidance for your application. Contact us for application-specific support.

Related Products

TJA1145

Standalone high-speed CAN transceiver.

View Product

SBC37152

System basis chip with LIN interface.

View Product

S32K Series

Automotive microcontrollers for body electronics.

View Product

Get Support

Our automotive-certified NXP FAEs are available to help with your design-in process. Contact us for:

  • SBC implementation guidance
  • Power management design
  • CAN network design
  • EMC compliance assistance
Contact Our Experts